CASPA Summer Symposium

CASPA Summer Symposium
The Booming Fabless Across the Pacific 2006


Time: July 15, 2006 (Saturday), 12:30pm to 5:00pm
Agenda:
12:30 - 1:00 PM Registration/Networking
1:00 - 1:15 PM CASPA President Opening Remarks
1:15 - 5:00 PM Speaker Presentation and Open Q&A
Place: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA 95054

Distinguished Speakers:
Mr. Nick Yu, Vice President, CDMA Technologies, Qualcomm Inc: "Growing Pains of the Fabless Semiconductor Industry - The Past, Present and Future"
Dr. Roawen Chen, VP of Manufacturing Operation, Marvell Semiconductor: "The Marvell Growth Story, and the Challenge/Opportunity of Fabless Industry"
Mr. Joseph Hong, General Manager, Faraday Technology USA: "USA Business Development Experiences of a Taiwan-based ASIC Service Company"
Mr. Sheng Lee, Chief Technology Officer, Ralink Technology Corp: "The Emergence of Ralink Technology as a Successful WLAN Chipset Supplier"
Mr. Xiaolong Liu, Executive Vice Managing Director, Shanghai Zhangjiang (Group) Co., Ltd. "The Development of Semiconductor Industry in Zhangjiang Hi-Tech Park"
Mr. Mark Ding, President, SEMI China: "Mainland China IC Industry Development and Opportunity Update"

I went to this event to support my cousin. It's pretty interesting to hear what people have to say about the industry today. As you have guessed, India and China are one of the popular vocab behind "fabless", which is the topic for the day. One of my favorite talk is given by Mr Xiaolong Liu, who is actually selling the hi-tech commerical area in Shanghai. It sounds like they are trying to turn Zhangjiang into "china silicon valley". I would love to check out the place if I'm going to Shanghai again. I really wanna to get a feel of the "new techie" Shanghai.